• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A solder wave pump comprises a solder trough (1), a compensating trough (3), a nozzle neck (9) with a nozzle attachment (10), at least one first pumping channel (5) and at least one second pumping channel, and a stator (8). The stator (8) has an iron core (13) with teeth (14) and grooves (15). Each first pumping channel (5) is connected to the solder trough (1) and opens into the nozzle throat (9). Every second pumping channel is connected to the compensation trough (3) and to the solder trough (1). The solder wave pump has either a single first pumping channel (5) or exactly two first pumping channels (5). The width of the single pumping channel (5) is greater by at least a factor of 6, or the width of the two pumping channels (5) is larger by at least a factor of 3 than the width (Z) of the teeth (14) of the iron core measured in the pumping direction ( 13). The slot of the nozzle attachment (10) has a length of at least 300 mm.
    公开号:CH712448A1
    申请号:CH00618/16
    申请日:2016-05-12
    公开日:2017-11-15
    发明作者:Degelo Patrick
    申请人:Kirsten Soldering Ag；
    IPC主号:
    专利说明:

    Description Field of the Invention The invention relates to an electrodynamic solder wave pump.
    Background of the Invention The electrodynamic solder wave pump delivers molten solder through a nozzle, thus creating the solder wave. Tin is mostly used as solder. Such pumps are used, for example, in soldering machines for the simultaneous soldering of components which are mounted on a printed circuit board (PCB). The requirements of such a pump are: - constant height of the solder wave over its entire width, - allows small and high tin delivery rates, - excludes wave divisions, - is low maintenance, and - results in high-precision soldering.
    The pump can be used for generating various solder waves such as jet-wave (hollow shaft), geyser-wave (bubble wave), etc. The advantage of this type of pump is that it has no mechanical moving parts.
    From DE 3 300 153 a soldering machine with an electrodynamic pump is known, which has a solder pot, a pump channel and a nozzle. The pumping channel consists of a narrow and a wide section. This has the consequence that in the transition from the narrow to the wide section, a cross-sectional spread takes place, which causes a significant vortex formation in the conveyed Lot. The vortices cause a non-homogeneous pressure distribution over the pump width, which must be corrected by a shadow mask with different hole sizes depending on the position. The shadow mask tends to clog quickly and wear, requiring frequent cleaning or replacement.
    From CH 690 843 an electrodynamic solder wave pump is known which has a plurality of relatively narrow, side by side pumping channels, which open on the outlet side in a common nozzle throat. From EP 849 023 an electrodynamic solder wave pump is known, in which the pumping channels extend in the vertical direction.
    Short description of the invention The solder wave pump described in CH 690 843 has been used in soldering machines for about 20 years. The invention has for its object to rework this pump and to improve its use and energy efficiency.
    The above object is achieved by the features of claim 1. Advantageous embodiments will be apparent from the dependent claims.
    An inventive solder wave pump comprises a solder pot with an overflow edge, a compensating tray for collecting solder flowing in operation over the overflow edge of the solder pot, a nozzle neck, a nozzle attached to the nozzle neck nozzle attachment with a slot from which the solder wave emerges, a single first pumping channel or exactly two first pumping channels and at least one second pumping channel, which run parallel to each other and define a pumping direction, and a stator. The stator is arranged below the pumping channels and has a comb-like iron core with teeth and grooves, which are arranged alternately in the pumping direction and extending perpendicular to the pumping direction, and with coils acted upon by currents. The length of the slot of the nozzle attachment is at least 300 mm. Each first pumping channel is connected on the inlet side with the solder trough and opens on the outlet side in the nozzle neck. Each second pumping channel is connected on the inlet side with the compensating trough and on the outlet side with the solder trough. The width of the first pumping channel is at least a factor of 6 greater than the width of the teeth of the iron core of the stator measured in the pumping direction, if the Lotwellenpumpe only a first pumping channel, or the width of each of the two first pumping channels is greater by at least a factor of 3 as the pump width measured width of the teeth of the iron core of the stator when the Lotwellenpumpe has two first pumping channels.
    The width of the first pumping channel or the total width of the two pumping channels in the area of the stator measured over all is advantageously at most 15% less than the length of the slot of the nozzle attachment.
    The lower part of the solder wave pump including the stator is preferably disposed within a housing having ventilation slots which are arranged so that the stator is purely passively cooled by passing convection air.
    Preferably, the teeth of the iron core on no recesses.
    The measured perpendicular to the pumping direction length of the coil windings is advantageously smaller than the width of the single first pumping channel and the total width of the first two pumping channels.
    Preferably, all pumping channels are formed by grooves which are attached to the bottom wall forming the outer wall of the solder pot and a groove covering the plate.
    The invention will be explained in more detail by means of embodiments and with reference to the drawing. Brief Description of the Drawings The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate one or more embodiments of the present invention and, together with the detailed description, serve to explain the principles and embodiments of the invention , The figures are drawn schematically and not true to scale for the sake of clarity of drawing.
    1.2 show in side sections the parts necessary for the understanding of the invention of a solder wave pump according to the invention,
    Fig. 3, 4 show a schematic plan view of two preferred embodiments of the inventive solder wave pump, and
    Fig. 5 shows the embodiment of FIG. 4, supplemented by some details.
    DETAILED DESCRIPTION OF THE INVENTION FIG. 1 shows schematically in a side sectional view the parts of a solder wave pump according to the invention required for the understanding of the invention. The solder wave pump comprises a solder trough 1 with an overflow edge 2, a compensating trough 3 for collecting solder 4, which flows over the overflow edge 2 of the solder trough 1, at least a first pumping channel 5 and at least one second pumping channel (FIG. 2), a nozzle and a Stator 8. The first and second pumping channels 5, 6 are substantially parallel to each other and define a pumping direction 7. The pumping direction 7 extends substantially in the horizontal direction. The nozzle comprises a nozzle neck 9 and a replaceable nozzle attachment 10 which is placed on the nozzle neck 9 and has a slot 11 through which the solder wave 12 exits. The stator 8 is arranged below the pumping channels 5, 6. The stator 8 comprises a comb-shaped iron core 13 whose comb teeth 14 and grooves 15 which are arranged alternately in the pumping direction 7 and extend in the plane defined by the line l-l plane perpendicular to the pumping direction 7 (this plane is perpendicular to the plane). The stator 8 further comprises coils which are placed in the grooves 15 between the teeth 14. For a better understanding, the coil strands of the windings 16 visible in FIG. 1, which belong to the same coil, are shown connected by a dashed line. The stator 8 and the pumping channels 5, 6 are separated by a thin plate 17, which preferably consists of a titanium sheet. The solder wave pump further has not shown heating elements.
    The at least one first pump channel 5 is connected on the inlet side with the solder pot 1 and opens on the outlet side in the nozzle neck 9. Such a pump channel 5 is visible in the sectional drawing of FIG. Each first pumping channel 5 is a main pumping channel through which liquid solder is pumped from the solder trough 1 into the nozzle to produce the solder wave 12.
    The at least one second pumping channel 6 is connected on the inlet side with the compensating trough 3 and on the outlet side with the solder trough 1. Each second pumping channel 6 is a secondary pumping channel through which liquid solder is pumped from the compensating trough 3 into the solder trough 1.
    The solder wave pump is an electrodynamic linear motor pump which pumps the solder in the pumping direction 7 through the pumping channels 5, 6. A control circuit supplies the coils with one current each. The number of coils is for example two or a multiple of two, so that the linear motor is a two-phase linear motor, or the number of coils is for example three or a multiple of three, so that the linear motor is a three-phase linear motor. Armotor is. In the embodiment of Fig. 1, the linear motor is a three-phase linear motor in which the number of teeth 14 of the stator 8 is nine and the number of coils is three, each coil comprising three windings 16 connected in series or parallel to each other are switched.
    In operation, the linear motor pumps on the one hand liquid solder from the solder pot 1 through the at least one first pump channel 5, the nozzle neck 9 and the nozzle attachment 10 and thus generates the solder wave 12, and on the other hand liquid solder from the balance tank 3 in the solder pot. 1
    The nozzle attachment 10 is typically a hollow shaft attachment or jet attachment that produces a hollow shaft for so-called wave soldering, or a bubble shaft attachment or geyser attachment that creates a bubble wave. The slot 11 of the nozzle attachment 10 is in the first case an open rectangular opening and in the second case designed as a perforated plate or covered with a perforated plate rectangular opening.
    Fig. 2 shows schematically a side sectional view similar to Fig. 1, but here is a second pump channel 6 instead of the first pumping channel 5 visible.
    3 and 4 show two preferred embodiments of the solder wave pump in a section in the direction indicated by the line l-l level of Fig. 1st
    FIG. 3 illustrates the first preferred embodiment in which the solder wave pump has a single first pumping channel 5 and one or more second pumping channels 6. This solder wave pump is preferably formed (as shown) with two second pumping channels 6, which are arranged on both sides of the first pumping channel 5. Also shown is the slot 11 of the nozzle attachment 10 (Figure 1), although the slot 11 is in a different plane. The first pumping channel 5 has a width B, the slot 11 has a length L. The length L of the slot 11 is the length measured in the horizontal direction perpendicular to the pumping direction 7.
    The width B of the first pumping channel 5 is approximately constant in the region of the stator 8 (FIG. 1). The first pumping channel 5 can widen somewhat towards the nozzle throat 9 or the nozzle throat 9 or the nozzle attachment 10 can widen somewhat. The width B of the first pumping channel 5 is typically slightly less than the length L of the slot 11, but typically at most 15% lower, i.e., less than the length L of the slot 11. B> 0.85 L. In other words, the first pumping channel 5 may become slightly wider towards its end on the exit side and / or the nozzle throat 9 and / or the nozzle attachment 10 may be slightly wider than the width B of the first pumping channel 5 in the actual pump area. The broadening in the end region of the first pumping channel 5 or in the nozzle neck 9 or at most in the nozzle attachment 10 of the nozzle is only so great that it does not lead to a disturbing vortex formation in the solder, which for example reduces the height of the solder wave 12 at its edges inadmissible.
    FIG. 4 illustrates the second preferred embodiment in which the solder wave pump has exactly two first pumping channels 5 and one or more second pumping channels 6. This solder wave pump is preferably formed (as shown) with a single second pumping channel 6, which is arranged between the two first pumping channels 5. Again shown is the slot 11 of the nozzle attachment 10 (Figure 1), although the slot 11 is in a different plane.
    The width BP of the two first pumping channels 5 is approximately constant in the region of the stator 8. The two pumping channels 5 open into the nozzle throat 9, where they can unite before the nozzle throat 9 to a single channel. The total width BG of the two pumping channels 5 is approximately equal to the length L of the slot 11 of the nozzle attachment 10, but may well be slightly less than the length L, but typically at most 15% lower, i.e., less than the length L. BG> 0.85 L, so that the broadening here also does not lead to a disturbing vortex formation in the solder.
    The solder wave pump according to the invention is distinguished from the known solder wave pumps in that, even with a large width of the solder wave of at least 300 mm, it has only one main pump channel or at most two main pump channels. A solder wave pump for producing solder waves of this width, if constructed according to the teaching of CH 690 843, would have at least six main pump channels.
    The width B of the single first pumping channel 5 in the embodiment according to FIG. 3 or the total width Bg of the first pumping channels 5 in the embodiment according to FIG. 4 is therefore significantly greater than the width Z measured in the pumping direction 7 (FIG. 1) of the teeth 14 of the iron core 13 of the stator 8. The total width BG (as shown in FIG. 4) is the width measured from the outer outer wall to the outer outer wall, ie the width of the first two pump channels 5 measured over all is illustrated below by means of numerical examples.
    The width of the solder wave 12 is equal to the length L of the slot 11 of the nozzle. In order to produce a solder wave of 300 mm width, the first pump channel 5 in the embodiment according to FIG. 3 has a width of at least 0.85 * 300 mm = 255 mm. The width Z of the teeth 14 of the iron core 13 is about 20 mm. Thus, B = 12.75 Z. In the embodiment according to FIG. 4, the two first pumping channels 5 each have a width of at least about BP = 110 mm, so that for the interposed second pumping channel 6 including intermediate walls with a total width BG of 255 mm Space of about 35 mm remains. In this case, BP = 5.5 Z.
    It can, with the same design of the stator 8 and with only a single first pump channel 5 according to the embodiment of Fig. 3 or with only two first pump channels 5 according to the embodiment of Fig. 4 also much wider solder waves of, for example, 380 mm or 460 mm (or even more) are generated, in which case the width B of the first pumping channel 5 or the total width BG of the two first pumping channels 5 is at least 0.85 * 380 mm = 323 mm or 0.85 * 460 mm = 391 mm. The width BP of the first two pumping channels 5 would then typically be about (323 mm -35 mm) / 2 = 144 mm and (391 mm -35 mm) / 2 = 178 mm, respectively. This results in a ratio of BP = 7.2 Z or BP ξ 9 Z.
    The teeth 14 of the iron core can also be narrower or wider depending on the design. The width B of the first pumping channel 5 is in any case wider than the width Z of the teeth 14. In any case, B> 6 Z or BP> 3 Z, preferably even B> 10 Z or BP> 5 Z.
    However, the invention is not limited to these specific numerical examples.
    The coils are made of copper wires, which are sheathed with an insulating layer. This insulating layer, which forms the conductor insulation, preferably consists of a temperature-resistant up to 550 ° C material. This makes it possible to form the iron core 13 of the stator 8 without ventilation slots.
    权利要求:
    Claims (6)
    [1]
    The lower part of the solder wave pump, i. in particular the stator 8, is preferably arranged within a housing 18 (FIG. 1), which has ventilation slots, which are arranged so that the stator 8 is cooled purely passively by passing convection air. The heated air from the stator 8 expands and flows through arranged in the vicinity of the stator 8 vents to the outside, while cooler air flows through mounted near the bottom ventilation slots. The solder wave pump therefore preferably has no fan to suck air and to blow through the stator 8. The convection cooling is also sufficient to cool the stator 8 sufficiently without the teeth 14 of the iron core 13 having to be formed with ventilation slots, as suggested by the CH 690 843. This has the advantage that this increases the efficiency of the linear motor. Fig. 5 shows substantially the embodiment of FIG. 4, supplemented around the teeth 14 of the iron core 13 and the windings 16 of the coils. Since the linear motor in this example is a three-phase linear motor, it comprises three coils, each of which includes three of the nine windings 16 shown. The coils 16 belonging to the same coil are electrically connected to each other, which is not shown here. The teeth 14 of the iron core 13 are formed throughout the entire width of the two first pumping channels 5 of constant height, i. they have no recesses, which would then result in the pumping direction 7 extending vents. The teeth 14 of the iron core 13 are slightly shorter than the total width of the first two pumping channels 5 in this example, but they can also extend beyond the lateral edges of the first two pumping channels 5. The intermediate wall (s) separating the first pumping channel (s) 5 from the second pumping channel (s) 6 are made of an electrically conductive material, e.g. made of pure iron. It is not necessary for this material to have good wettability for the solder. All pumping channels 5, 6 are preferably formed by grooves, which are attached to the bottom wall forming the outer wall of the solder pot 1, and the plate 17, which covers the grooves. The pump according to the invention offers several advantages:
    1. The greatly improved efficiency means that the pump performance is sufficient for any nozzle attachments, namely adjustable nozzles, specific perforated plates as well as nozzles with programmable openings, with moderate energy consumption.
    [2]
    2. The formation of the solder pump with only one or two first pumping channels which convey the solder through the nozzle results in a laminar, i. largely vortex-free, flow of the solder and thus a homogeneous pressure distribution over the entire width of the solder wave. The homogeneous pressure distribution is achieved in the entire speed range for which the soldering pump is designed. This in turn leads to a greatly reduced formation of dross, to a reduction in the wear of the components used and in turn to less contamination of the solder pot. The reduction of the impurities makes it possible to improve the temperature control of the solder in the solder pot.
    [3]
    3. The solder pump is particularly suitable for use in a soldering system, in which the transport of the boards to be soldered in the horizontal direction. This solder flow laminar flow pump, the variably adjustable solder flow speed, and the variable height of the solder tray to the transport height of the boards make it possible to meet all the requirements of all the various boards on the market today. While embodiments of this invention have been shown and described, it will be apparent to those skilled in the art that more modifications than mentioned above are possible without departing from the inventive concept. The invention is therefore limited only by the claims. claims
    1. A solder wave pump, comprising a solder trough (1) with an overflow edge (2), a compensating trough (3) for collecting solder (4), which flows in operation over the overflow edge (2) of the solder trough (1), a nozzle throat (9 ), a nozzle cap (10) placed on the nozzle throat (9), having a slot (11) from which the solder wave (12) emerges, the length (L) of the slot (11) being at least 300 mm, a single first pumping channel (5) or exactly two first pumping channels (5) and at least one second pumping channel (6) which run parallel to one another and define a pumping direction (7), wherein each first pumping channel (5) is connected to the soldering trough (1) on the inlet side and on the outlet side in the nozzle throat (9) opens and each second pumping channel is connected on the inlet side with the compensating trough (3) and on the outlet side with the solder trough (1), and a stator (8) below the pumping channels (5 , 6) is arranged and a comb-like iron core (13) mi t has teeth (14) and grooves (15) arranged alternately in the pumping direction (7) and extending perpendicularly to the pumping direction (7), and comprising coils which can be subjected to currents, characterized in that the width (B) of the first Pump channel (5) by at least a factor of 6 is greater than the measured width in the pumping direction (Z) of the teeth (14) of the iron core (13) of the stator (8) when the Lotwellenpumpe only a first pump channel (5), or Width of each of the two first pumping channels (5) by at least a factor of 3 is greater than the width (Z) measured in the pumping direction of the teeth (14) of the iron core (13) of the stator (8), when the Lotwellenpumpe two first pumping channels (5 ) having.
    2. wave wave pump according to claim 1, characterized in that the width (B) of the first pumping channel (5) or over all measured total width (BG) of the two first pumping channels (5) in the region of the stator (8) at most 15% lower is as the length of the slot (11) of the nozzle attachment (10).
    3. solder wave pump according to claim 1 or 2, characterized in that the lower part of the Lotwellenpumpe including the stator (8) within a housing (18) is arranged, which has ventilation slots, which are arranged so that the stator (8) purely passive can be cooled by passing convection air.
    [4]
    4. solder wave pump according to claim 3, characterized in that the teeth (14) of the iron core (13) have no recesses.
    [5]
    5. solder wave pump according to one of claims 1 to 4, characterized in that the measured perpendicular to the pumping direction length of the coil windings is smaller than the width (B) of the single first pumping channel (5) or the total width (BG) of the two first pumping channels ( 5).
    [6]
    6. solder wave pump according to one of claims 1 to 5, characterized in that all the pumping channels (5, 6) by grooves which are attached to the bottom forming the outer wall of the solder pot (1) and a grooves covering plate (17) are formed ,
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    同族专利:
    公开号 | 公开日
    CH712448B1|2020-01-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JPS58215269A|1982-06-08|1983-12-14|Toshiba Corp|Brazing device|
    JPS58218372A|1982-06-14|1983-12-19|Toshiba Seiki Kk|Brazing device|
    CH690843A5|1995-11-07|2001-02-15|Kirsten Kabeltechnik Ag|Electrodynamic linear motor pump for wave soldering and method for its operation.|
    法律状态:
    2019-08-30| PUE| Assignment|Owner name: KIRSTEN SOLDERING LTD, MT Free format text: FORMER OWNER: KIRSTEN SOLDERING AG, CH |
    优先权:
    申请号 | 申请日 | 专利标题
    CH00618/16A|CH712448B1|2016-05-12|2016-05-12|Electrodynamic solder wave pump.|CH00618/16A| CH712448B1|2016-05-12|2016-05-12|Electrodynamic solder wave pump.|
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